Heerkulka LGA1700-BCF/AMD-ASF CPU hagaajinta hagaajinta hagaajinta Buckle CNC Aluminium Alloy for Intel Gen 12/AMD RYZEN 7000 CPU

Sharaxaad Gaaban:

  • Heerkulka LGA1700-BCF/AMD-ASF CPU hagaajinta hagaajinta go'an ee CNC Aluminium Alloy ee Intel Gen 12/AMD RYZEN 7000 CPU
  • Intel jiilka 12-aad ee CPU
  • Faahfaahin:
  • Magaca: Qaab-dhismeedka ka-hortagga-laabashada CPU
  • Waxyaabaha: aluminium aluminium
  • Midabka: madow, cawl, casaan, buluug (ikhtiyaar)
  • Lagu dabaqi karo: Kaliya sii taageerada jiilka 12-aad ee Intel CPU, godka Motherboard-ka CPU waa LGA1700, Chipset-kuna waa taxanaha H610 B660 Z690
  • Cabbirka: Dhererka 54mm Balladhka 70mm Dhererka 6mm
  • Miisaanka: jirka ugu weyn 20g; guud ahaan 50g
  • Sharaxaada badeecada:
  • Thermalright waxay u abuurtaa xal ka-hortagga qalooca soo-saarayaasha Intel's Alder Lake
  • Soo-saareyaasha Intel's Alder Lake waxay u nugul yihiin dabacsanaan iyo dagaal, cilad ku timid nidaamka xiritaanka Intel LGA1700 CPU. Iyada oo laga jawaabayo dhibaatadan, "qaab-ka-hortagga qalooca" ayaa la sameeyay, oo loogu talagalay in laga hortago qalloocinta / leexinta Alder Lake CPUs.
  • LGA1700-BCF, oo ah qaab aluminium ah oo beddelaya habka kor u qaadista CPU ee godka LGA1700 CPU ee shirkadda. Qaab-dhismeedkani waxa uu ku habboon yahay processor-ka oo waxa lagu xidhay boolal fudud. Qaab-dhismeedka wuxuu quseeyaa xitaa cadaadis badan soo-saareyaasha Intel's Alder Lake, taasoo yareyneysa fursadda dagaal. Si kastaba ha noqotee, Intel wuxuu ka digayaa in xalkan kor u kacaya uu burin karo dammaanadda CPU, markaa macaamiishu waa inay ka digtoonaadaan tan.
  • LGA 1700 Anti-Bend Buckle wuxuu qaataa dhammaan aluminium-aluminiumka CNC ee hannaanka dahabka anodized ee ciid qarxinta, oo leh cabbir guud oo ah 70 x 54 x 6 mm iyo culeyska guud ee 50g. Meelaynta saxda ah waxay ka fogaan kartaa capacitors-ka Motherboard-ka, waxayna isticmaashaa suufka ilaalinta dahaarka ee asalka ah ee LOTES, waxayna sidoo kale bixisaa qaabab midabyo kala duwan.
  • Marka la barbar dhigo xayndaabyadii hore ee guriga lagu sameeyay, LGA 1700 xidhidhka lidka-laabashada ayaa aad uga dhammaystiran qaabaynta iyo tayada wanaagsan. Intaa waxaa dheer, qiimuhu waa mid la awoodi karo. Z690, B660 iyo H610 Motherboard-yada ayaa isticmaali kara LGA 1700-ka-hortagga qalooca
  • Tilmaam:
  • 1. Isbarbardhigga: Marka la barbardhigo alaabada kale ee la midka ah, badeecadani waxay isticmaashaa cadaadis afar geesood ah halkii ay ka isticmaali lahayd cadaadis badan, oo leh meelaynta saxda ah, ka fogaanshaha awoodda, taas oo ku habboon hagaajinta CPU;
  • 2. suufka ilaalinta dahaarka: dusha sare ee xidhiidhka ee looxa weyn waa hoos siman, iyo suufka ilaalinta dahaarka ee asalka ah ee LOTES ee isla qeexitaanka ayaa loo isticmaalaa si loo yareeyo cadaadiska guddiga weyn oo sii yareynaya faragelinta calaamadaha;
  • 3. Faragelinta isha: Dusha birta ah ayaa kor loo qaadayaa si loo yareeyo faragelinta calaamadda dhinaca Motherboard-ka;
  • 4. Material: Qalabkan orthotic CPU wuxuu leeyahay laba midab: madow iyo casaan. Waxay ka samaysan tahay ciid anodized ah oo qarxinaysa dhammaan aluminium aluminium aluminium CNC machining sax ah, waxay isticmaashaa suufka dahaadhka asalka ah, waxaana lagu hagaajiyaa boolal godad laba geesood ah. Way fududahay in la rakibo oo waxay yarayn kartaa dhexgalka dufanka silikoonka ee cidhifka CPU;
  • 5. Sharaxaad: Iyadoo loo eegayo naqshadeynta AMD Ryzen 7000 "qaab gaar ah" daboolka sare ee CPU, marka la rakibayo hiitarka, cadaadiska rakibaadda awgeed, waxaa jiri doona dufan silikoon ah oo kuleylka kuleylka ah oo la sii daayay, kaas oo ku urursan doona farqiga u dhexeeya AMD Ryzen 7000 CPU, oo laga yaabo inay adagtahay in meesha laga saaro, ama xitaa ku daadato capacitor-ka, taas oo keeni karta khatar badbaado.
  • AMD RYZEN 7000
  • Asal ahaan: Dhul-weynaha Shiinaha
  • Nambarka Model: Bracket CPU
  • Nooca: Haystaha CPU
  • Midabka: Madow, Casaan (ikhtiyaar)
  • Guryaha: Ma jiro dufan silikoon, oo leh dufan silikoon (ikhtiyaar)
  • Qalabka: Aluminium alloy
  • Habka: CNC anode ciid
  • Qalabka hagaajinta: kaashawiito nooca L-ga ah
  • Cabbirka: 70x54x6mm/2.76×2.13×0.24in
  • Miisaanka: Jirka 20g, guud ahaan 55g
  • Habka rakibida:
  • 1. Motherboard-ka si siman u dul saar desktop-ka kadibna fur clip-ka CPU
  • 2. Isticmaal kaashatada T20 Torx ee ku lifaaqan si aad uga saarto qaybta sare oo aad gees ka dhigto xidhidhka hoose
  • 3. Geli CPU-ga
  • 4. Dabool xajmiga la hagaajiyay ee daboolka sare ee CPU oo si tartiib ah u dhaqaaji ilaa uu meesha soo galo
  • 5. Ku adkee furayaasha xagasha ka soo horjeeda nus leexasho. Kaalle kastaa wuxuu qaataa kala badh sida ay u kala horreeyaan ilaa inta la isku duubayo, waxay cadaadis saaraysaa CPU si aan sinnayn.
  • Fiiro gaar ah:
  • Dufan kuleyl la'aan.
  • Iyada oo ay ugu wacan tahay kormeeraha kala duwan iyo saamaynta iftiinka, midabka dhabta ah ee shayga ayaa laga yaabaa in uu ka yara duwanaado midabka lagu muujiyey sawirrada. Mahadsanid!
  • Fadlan ogow 1-2cm cabbirida weecanka sababtoo ah cabbirka gacanta
  • xirmo
  • 1X Qalabka Qaab-dhismeedka Ka-hortagga Qalooca
  • 1X kaashawiito L-qaabeeya

Faahfaahinta Alaabta

Tags Product

Faahfaahinta Show

Thermalright-LGA1700-BCF-AMD-ASF-CPU-Qaabka-Habitaanka-Habitaanka-Go'an-CNC-Aluminium-Alloy-for-Intel-Gen (1)
Thermalright-LGA1700-BCF-AMD-ASF-CPU-Qaabka-Habitaanka-Habitaanka-Go'an-CNC-Aluminium-Alloy-for-Intel-Gen (2)
Thermalright-LGA1700-BCF-AMD-ASF-CPU-Qaabka-Habitaanka-Habitaanka-Go'an-CNC-Aluminium-Alloy-for-Intel-Gen (3)
Thermalright-LGA1700-BCF-AMD-ASF-CPU-Qaabka-Habitaanka-Habitaanka-Go'an-CNC-Aluminium-Alloy-for-Intel-Gen (5)
Thermalright-LGA1700-BCF-AMD-ASF-CPU-Qaabka-Habitaanka-Habitaanka go'an-CNC-Aluminium-Alloy-for-Intel-Gen (4)
Thermalright-LGA1700-BCF-AMD-ASF-CPU-Qaabka-Habitaanka-Habitaanka-Go'an-CNC-Aluminium-Alloy-for-Intel-Gen

  • Kii hore:
  • Xiga:

  • Halkan ku qor fariintaada oo noo soo dir